MalaysianUpdates

Category: Semiconductor & Processors

  • Malaysia to Host SEMICON Southeast Asia 2026, Uniting Global Leaders to Shape the Future of Semiconductors

    SEMICON Southeast Asia (SEMICON SEA) 2026, the region’s premier platform for the global semiconductor and electronics manufacturing supply chain, will return to the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur from 5 to 7 May. Registration is now open.

    The event highlights the growing strategic importance of Southeast Asia within the global semiconductor ecosystem, as the region continues to strengthen its role in advanced manufacturing and supply chain resilience. In Malaysia, the event is held in strategic partnership with the Ministry of Investment, Trade and Industry (MITI) and the Malaysian Investment Development Authority (MIDA), reflecting the country’s continued commitment to strengthening its position in the global semiconductor value chain.

    SEMICON SEA 2026, themed Transform Tomorrow, will focus on accelerating next-generation technologies while addressing current structural challenges. It is expected to gather more than 20,000 innovators, policymakers, and technology experts, fostering collaboration across the international semiconductor ecosystem while delivering insights into artificial intelligence, smart manufacturing, sustainability, workforce development, advanced packaging, supplier sourcing, and other key areas.

    The global semiconductor industry is projected to reach USD1 trillion in annual sales by 2026, driven by the rapid expansion of artificial intelligence infrastructure. Market analysts note that Southeast Asia has emerged as a significant growth engine for the industry, outperforming the broader market in recent years, supported by sustained expansion in manufacturing capacity, assembly, testing, and packaging activities, as well as deeper integration into global supply chains.

    According to Ajit Manocha, President and CEO of SEMI, the semiconductor industry is entering a new era defined by ecosystem-wide collaboration. He noted that SEMICON Southeast Asia reflects this shift through programmes designed to bridge innovation and execution, from design through manufacturing, and expressed SEMI’s anticipation of hosting the event in Malaysia, a long-established semiconductor hub.

    Linda Tan, President of SEMI Southeast Asia, said SEMICON Southeast Asia serves as a catalyst for collaboration and innovation by bringing together industry leaders, visionaries, and experts to address pressing challenges and explore emerging opportunities, enabling stakeholders to shape the future of the semiconductor industry.

    In Malaysia, the semiconductor industry is entering its next phase of growth from a position of strength. The electrical and electronics (E&E) sector secured RM28.5 billion in approved investments in 2025, reinforcing its role as a cornerstone of the national manufacturing economy and a trusted node in the global technology supply chain. SEMICON SEA 2026 comes at a time when Malaysia is moving beyond its established strengths in assembly and test towards higher-value activities, including design, advanced packaging, and innovation-driven manufacturing.

    According to Datuk Sikh Shamsul Ibrahim Sikh Abdul Majid, Chief Executive Officer of MIDA, the semiconductor industry is at an inflection point and Malaysia intends to be at the centre of its next phase. He noted that under the New Industrial Master Plan (NIMP) 2030, Malaysia is not only maintaining its position in the global semiconductor supply chain but actively reshaping it. He added that strong investment fundamentals, including RM28.5 billion in E&E investments in 2025, reflect continued global confidence in Malaysia, which the country is building upon through supply chain integration, local capability development, and high-value partnerships. MIDA, he said, is an active builder of the industry’s next chapter in Malaysia, working collaboratively to shape its future.

    SEMICON SEA 2026 will focus on several key pillars, including artificial intelligence and intelligent manufacturing, sustainability, talent development, advanced packaging and heterogeneous integration, and supplier sourcing. These areas aim to accelerate innovation, strengthen ecosystem linkages, and support the development of a future-ready workforce.

    MIDA will also lead several initiatives at the event, including a Supply Chain Integration & Capability Enhancement Forum to strengthen industry linkages and supplier capabilities, a Digital Twin & Smart Manufacturing Seminar for SMEs to enhance technological adoption, and the Handshake@SEMICON programme, which facilitates structured engagements between global industry leaders and Malaysian stakeholders to accelerate investment and partnerships. In addition, MIDA will contribute to workforce development discussions through SEMI’s TECH Zoomers programme at Universiti Kebangsaan Malaysia (UKM), focusing on talent trends and future skills in the semiconductor sector.

    SEMICON SEA 2026 is further supported by leading global industry sponsors, including GlobalFoundries, Lam Research, Micron, Sandisk Corporation, Tokyo Electron Limited, Applied Materials, Schneider Electric, SGS, Soitec, STATS ChipPAC, Advantest, ASE, KLA, Kulicke & Soffa, Siemens, and STMicroelectronics.

    Registration for SEMICON SEA 2026 is now open. For full programme and conference details, please visit the SEMICON SEA website.

  • AMD Launches EPYC Embedded 2005 Series Processors: High-Performance, Energy-Efficient Solutions in a Compact Form Factor for Networking, Storage, and Industrial Applications

    AMD Launches EPYC Embedded 2005 Series Processors: High-Performance, Energy-Efficient Solutions in a Compact Form Factor for Networking, Storage, and Industrial Applications

    AMD has unveiled its latest EPYC Embedded™ 2005 Series processors, engineered to deliver high-performance, power-efficient computing in compact designs tailored for networking, storage, and industrial environments where power, space, and thermal constraints are critical. Built on the proven Zen 5 architecture, these processors feature up to 16 x86 cores, 64 MB of shared L3 cache, and configurable thermal design power (TDP) ranging from 45W to 75W, offering designers the flexibility to optimize for performance, energy efficiency, and thermal management. The processors come in a highly integrated 40mm × 40mm BGA package, 2.4 times smaller than comparable Intel Xeon solutions, enabling higher compute density, shorter electrical paths for better signal integrity, and improved thermal performance, making them ideal for 24/7 operation in constrained infrastructures.

    The EPYC Embedded 2005 Series also delivers exceptional performance per watt, with up to 28 percent higher boost CPU frequency and 35 percent higher base CPU frequency compared to comparable Intel solutions, enabling superior performance density and lower total system cost. These processors are purpose-built for long-life deployments, supporting up to 10 years of continuous field operation, component availability, and technical assistance, alongside 15 years of software maintenance, ensuring stability and a strong return on investment. Advanced Reliability, Availability, and Serviceability (RAS) features detect, prevent, and correct errors to minimize downtime, while application-specific features such as BMC support, PCIe Hot Plug, and multi-SPI ROM provide additional design flexibility. Security is reinforced with AMD Infinity Guard technologies, including AMD Secure Processor, AMD Platform Secure Boot, and AMD Memory Guard, safeguarding data integrity and system reliability for mission-critical applications.

    Connectivity and modularity are central to the EPYC Embedded 2005 Series, offering 28 lanes of PCIe Gen5 for high-speed I/O integration, including Ethernet NICs, FPGAs, and networking ASICs, while DDR5 memory support ensures higher memory bandwidth and future-proofing as DDR4 phases out. The processors are complemented by a robust open-source software ecosystem, with upstream support for Yocto, kernel drivers, and the Extended Development Kit (EDK II), simplifying integration and accelerating time to market. Targeting AI-driven workloads, modern networking switches, routers, DPU control planes, cold cloud storage, aerospace, and robotics applications, the AMD EPYC Embedded 2005 Series delivers the performance, energy efficiency, security, and longevity required for the next generation of embedded infrastructure systems.